Thermally Conductive Foils /Sheets made of silicone

Thermally Conductive Foils /Sheets made of silicone

The thermal conductivity of silicone is known to be zero. Only by the formulation of thermally conductive ceramics such as bornitride, aluminium oxide, aluminium nitride or other mixtures into the polymer structure of the elastomer is the technically required thermal conductivity achieved. Special, specifically patented manufacturing processes from the home of the DENKA guarantee the correct geometric introduction of the heat conducting particles into the polymer structure of the silicone elastomer. As a result, considerable thermal conductivity is achieved while at the same time optimum overall transfer resistance is archieved as well. The overall result is therefore excellent thermal, mechanical and electrical properties for the different products.

Properties Unit ICT-BFG08-A ICT-BFG20 ICT-BFG20-A ICT-BFG30 ICT-BFG30-A ICT-BFG45 ICT-BFG45-A ICT-BFG80 ICT-BFG80-A
mm 0,08 0,20 0,20 0,30 0,30 0,45 0,45 0,80* 0,80*
Material Aufbau silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber silicone with glass fiber
Color - White Light Green White White White White White White White
Filler - Bornitrid Bornitrid Bornitrid Bornitrid Bornitrid Bornitrid Bornitrid Bornitrid Bornitirid
Density g/cm³ 1,7 1,7 1,7 1,7 1,7 1,7 1,7 1,7 1,7
Outgassing (LMW Siloxane) sum D3-10 ppm <14 <5 <14 <5 <14 <5 <14 <5 <14
UL flammability rating UL V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Breaking strength (kN/m) (kN/m) 38 117 41 88 37 59 36 39 28
Tensile strength MPa 8 25 9 20 8 14 5 9 4
Hardness Durometer A 90 88 90 88 90 88 89 88 88
Foldamability (mm) ømm 0,8 1,20 1,00 1,20 1,20 3,10 1,20 5,00 3,10
Dielectric strength kV (AC) - 3.0 3.0 6.5 6.0 9.0 9.0 >10.0 >10.0
Volume Resistance Ω/cm 5,30 x 1015 1,90 x 1015 1,70 x 1015 2,40 x 1015 7,90 x 1015 3,30 x 1015 9,20 x 1015 4,10 x 1015 8,90 x 1015
Dielectric constant - 2,0 3,6 3,3 3,6 3,3 3,6 3,3 3,6 3,3
Thermal Resistance TO-3 °C/W 0,08 0,18 0,12 0,20 0,15 0,25 0,19 0,36 0,30
Thermal resistance (TO-3P / ca. 360mm²) °C/W 0,21 0,37 0,28 0,42 0,29 0,51 0,32 0,77 0,66
Thermal conductivity W/m*K 5,00 4,10 5,00 4,10 5,00 4,10 5,00 4,10 5,00
Operating temperature °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C
Properties Unit ICT-BR20 ICT-BS20 ICT-BS30 ICT-M30
mm 0,23 0,20 0,30 0,30
Material Aufbau Silicone with glass fiber Silicone with glass fiber Silicone with glass fiber Silicone with glass fiber
Color - White Light Green Green Yellow
Filler - Bornitrid Bornitrid Bornitrid Bornitrid
Density g/cm³ 2,1 1,7 1,6 2,5
Outgassing (LMW Siloxane) sum D3-10 ppm - - - - -
UL flammability rating UL 94 VO V-0 V-0 V-0
Breaking strength (kN/m) (kN/m) 26,1 117 88 98
Tensile strength MPa 75 25 18 24
Hardness Durometer A 75 88 89 91
Foldamability (mm) ømm <1,3 Completely foldable Completely foldable 1,20
Dielectric strength kV (AC) 2.0 3.0 5,1 5,5
Volume Resistance Ω/cm 4,40 x10^14 1,80 x 1015 2,60 x 1015 1,70 x 1015
Dielectric constant - 4,6 3,5 3,5 4,0
Thermal Resistance TO-3 °C/W 0,16 |0,19 0,19 0,21 0,64
Thermal resistance (TO-3P / ca. 360mm²) °C/W 0,21 0,40 0,45 1,27
Thermal conductivity W/m*K 4,00 3,90 3,90 1,40
Operating temperature °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C from -60 °C to 180 °C

The thermally conductive sheets, which are offered by us, with different thermal conductivity, all have a certain surface softness, which enables optimum efficient connection of the contact surfaces.

Some important features to emphasize:
  • The thermal conductivity of all film types is excellent, as well as the thermal resistance which can be extremely low with suitable and correct application.
  • The mechanical strength is greatly improved by the use of glass fibres. The risk of the Tim being destroyed by mechanical stress during assembly is minimized.
  • The handling processes often described in specialist literature or semiconductor manufacturers such as the additional use of thermal paste are not necessary; So there is no risk of contamination. In comparison, this feature does not have mica or ceramics at all.
  • Stable heat transfer properties can be achieved even at low tightening torques.
  • The dielectric of the films is half lower than is usual for ceramic discs or mica.
More features in brief:
  • Material thicknesses from 0.08 to 0.8 mm
  • Thermal conductivity up to > 5 W/mK
  • Thermal resistance below 0.08 °c-inch2/W
  • Mechanical stability due to glass fibre reinforcement
  • No residue after removal (maintenance, inspection)
  • Non-combustible according to UL 94 VO
  • Available on Reel
  • One-sided self-adhesive (AV)
  • In blanks and shapes according to customer specification
  • In the form of sheets and mats
Declaration article name:
Processor Provider | Material | Thickness | Liability | Delivery Format
Example:         ICT | BFG100-A  |  0.08mm  | 1h          | Loose/sheet/rolle
Thermal connection of:
  • MOSFETs and IGBTs on heat sinks
  • High Power LED/cob
  • Diodes and rectifiers on heat sinks
  • Electronic modules on heat sinks
  • Capacitors and PTC Elements
  • Electrical Battery storage Media
  • Braking and power resistors
  • More
For example in:
  • Inverters and Power Supplies
  • Motor Controls at Automotiveanwendungen
  • LED street lighting (light bulb)
  • White Goods (controls)
  • Industrial computers
  • UPS Equipment
  • Wind turbines
  • Commercial Vehicle Area
  • Car interior Heater