Silicone caps, tapes and tubes

Silicone caps, tapes and tubes

ICT-TR, HR are thermally conductive so-called "box-shaped" caps for many common transistor types. The manufacturing of the cap is occurred in a so-called co-molding process, in which case the two cap halves are pressed in one mold and then final welded.

ICT-TR, HR tubes and tapes are produced in the so-called extruded production process. The heat conducting caps, tapes and tubes are made on the basis of noncombustible silicone rubber and heat-conducting ceramic formulated materials. The product groups have very high electrically insulation properties and very good thermal conductivity (≥ 2 W / mK)

Here, too, the application inevitably dictates the most suitable TIM, since the heat released in this process must be dissipated quickly and reliably in order to protect the electronic components. Exactly here ICT SUEDWERK is using with his high performance co-operation partner & supplier Nucletron-Fujipoly thermally conductive and electrically insulating caps, tapes and tubes on.

The thermal caps dispose a very good thermal conductivity due to the special formulation and filling of the silicone with ceramic fillers. This considerably reduces the total contact resistance be and ensures an optimal thermal path for a very good thermal performance.

This all-round insulation of the components provides, depending on the material thicknesses, an optimum protection against electrical voltage breakdowns while at the same time reducing the overall thermal transfer resistance to the thermal contact such as e.g. heat sinks or housings.

The very high electrical insulation due to the box-shaped design of the caps completes the excellent performance of the products. ICT-TR, HR caps are available in different material types and in different material thicknesses.

All standard products on stock available; more end-user configurations are possible at any time and after consultation. Custom sizes are also available within a short time (die cutting of caps and Tubes into the corresponding length through own in-house production any time possible).

Do you also require heat-conducting extrusion profiles?

Then you are exactly right here because our partners deliver also here customized possible solutions in which the heat conducting element not only produces the thermal contact, but also takes on additional tasks in the overall construction, for example as a gasket.

Do not hesitate and contact us or our ICT4TIM co-operation partner at:


Passive heat management:

Werner.Heckler@nucletron.de
+49 89 149002-74  http://www.nucletron.de

Properties Unit ICT-NF-TR-HR
Material Aufbau silicone Rubber
Wall thickness mm 0,30|0,45|0,50|0,90
Color - greenish grey| Brown| Grey
Filler - Ceramic filler
Density g/cm³ 2,3 ~ 2.4
outgassing Total mass loss % ASTM E595 0.19
UL flammability rating UL 94 V-0
Tensile strength MPa 4.3 ~ 4.5
Hardness Durometer A 75 ~ 85 IRHD
Elongation % 60 % ~ 100 %
Dielectric strength kV (AC) 10 ~ 15
Volume resistivity Ω/m 1,00 x10^ –13
Dielectric constant (1kHz) - 4,40 ~ 4.9
Dielectric constant - 4,4 ~ 4.9
Thermal Resistance TO-3 °C/W 0,39 ~ 0.76
Thermal conductivity W/m*K 1,20 ~ 1.70 hot Wire methode
Operating temperature °C from -40 °C to 150 °C

Other characteristics shortly briefly listed:

  •      Very good thermal conductivity
  •      Low thermal total transient resistance
  •      Safe electrical all-round insulation
  •      Very high dielectric strength
  •      Not combustible according to UL 94 VO
  •      Low outgassing behavior
  •      Very good surface adaptation
  •      Extremely aging / chemical resistant
  •      Residue-free removal by application
  •      Clean, fast and reliable assembly
  •      No additional thermal grease necessary

In many standard sizes as well as according to customer specifications in cut and shape also available in small quantities

Technical Description:

ICT-TR, HR caps for discrete semiconductors (TO transistor dimension). High heat dissipation rate. Open at one end; installed by simply slipping over the desired components.
ICT-TR, HR tubes for discrete semiconductors (TO transistor dimension). High heat dissipation rate. Open at both end; installed by simply slipping over the desired components.
Available in many TO standard dimension, see also chart

ICT-TR, HR tapes for discrete semiconductors (TO transistor dimension)  as die-cut gaskets which are simple to install and easily conform to uneven surfaces between semiconductor packages and nearby heat sinks. The physical characteristics of this product also allow it to act as a low-pressure mounting cushion to prevent deformation.



Dimensions according to customer requirements / special designs are possible

DELIVERY FORMS

Availible (wall) thickness 0,30 mm, 0,45 mm, 0,50 mm & 0,90 mm

Different sizes (see chart; Dimensions)

APPLICATIONS

  •      Thermal connection of e.g.
  •      MOSFETs and IGBTs
  •      Diodes and rectifier
  •      Inverters
  •      Power supplies / facilities
  •      motor controls
  •      Automotive applications
  •      solar technology