ICT-TC-Thermal Interface Silicone Soft & Ultra Soft-Pads... the complete product line up will be available soon

ICT-TC-Thermal Interface Silicone Soft & Ultra Soft-Pads... the complete product line up will be available soon

ICT-TC-Thermal Interface Silicone Soft & Ultra Soft-Pads. The softsilicone product range from Shin-Etsu Silicones
ranges are thermally highly conductive, electrically highly insulating, soft and ultra-soft silicone-based elastomers which very excellent thermal junction can be achieved. The soft and ultra-soft thermally conductive Pads consist of silicone rubber in combination with highly thermally conductive gapfillers. They are available as single or as multi composite layer.
Alle types also dispose extraordinarily high electrical insulation strength.

The extremely high softness and conformability of the soft silicone enables it to be adapted to irregular or complex surfaces. Air gaps between heat-generating components and heat sinks can thus be successfully filled and thermally junction. As a result, an optimum thermal transition is achieved even at very low pressure on the surfaces to be contacted. This considerably minimizes the overall thermal transfer resistance and creates an optimum thermal path.

The special formulation of these products with proprietary high-quality ceramic powder, which enables a very high thermal conductivity of up to more than 5 W/m*K, should be emphasized.

The natural adhesion of these product line up here also enables very good pre-application, and thus use in automated placement systems.
Following products are available:
1.Soft Thermal Pads

Product-ID

Type

Dichte / Density

 @23° C (g/cm3)

Thermal Conductivity (W/m*K) ISO 22007-2

Thermal Conductivity (W/m*K) ASTM E 1530

ICT-TC-HSV-1.4 Series

Soft Thermal Pads

2.5

1.2

1.4

ICT-TC-HS-1.4 Series

Soft Thermal Pads

2.9

1.2

1.4

ICT-TC-TXE Series

Soft Thermal Pads

3.1

3.3

5.0

ICT TC-TXS Series

Soft Thermal Pads

3.1

3.3

5.0

ICT-TC-TXS2 Series

Soft Thermal Pads

3.1

3.3

5.0

2. Ultra Soft Thermal Pads:

Product-ID

Type

Dichte / Density

 @23° C (g/cm3)

Thermal Conductivity (W/m*K) ISO 22007-2

Thermal Conductivity (W/m*K) ASTM E 1530

ICT-TC-CAB-10 Series

Ultra Soft Thermal Pads

2.2

2.3

- -

ICT-TC-CAD-10 Series

Ultra Soft Thermal Pads

3.0

3.2

3.2

ICT-TC-CAS-10 Series

Ultra Soft Thermal Pads

1.9

1.8

1.8

ICT-TC-CAT-20 Series

Ultra Soft Thermal Pads

3.2

- -

4.5

ICT-TC-SP-1.7 Series

Ultra Soft Thermal Pads

2.3

1.5

1.7

ICT-TC-SPA-3.0 Series

Ultra Soft Thermal Pads

2.4

2.3

3.0

Properties Unit ICT-TC-TXE SERIE ICT-TC-TXS SERIE
Material Aufbau Silicone Softpad Silicone Softpad
Material gauge (mm) mm 0,50 |1,00|1,50|2,00||2,50|3,00|4,00 und 5,00 mm 0,50 |1,00|1,50|2,00||2,50|3,00|4,00 und 5,00 mm
Color - Grey Grey
Filler - Thermally conductive ceramic Thermally conductive ceramic
Density g/cm³ 3,1 3,1
Outgassing (LMW Siloxane) sum D3-10 ppm 240 240
Outgassing (LMW Siloxane) sum D11-20 ppm 450 450
Flame Retardancy UL94 Ul 94 VO Ul 94 VO
Hardness (Shore A) Shore A 29,00 32,00
Hardeness (Shore 00) Shore 00 50,00 88,00
Hardness (Shore A) Asker C 20,00 45,00
Tensile strength MPa 0.80/0,50mm|0.50/1,00mm|0.46/2,00mm|0.44/3,00mm 3.1
Dielectric strength (Voltage ramp) V (AC) 11000 |21000|>21000 8000 >15000
Dielectric strength (Voltage steps) V (AC) 8000 |20000|>20000 6000 >15000
Volume resistivity Ω/m 2,30 x10^10|5,1x^10|1,2x10^10|1,1x^10 1,00 x 10^10
Thermal conductivity W/m*K 5,00 5,00
Thermal resistance (inch² / 645,16mm²) K/W 0,27 /0,50 mm|0,48/1,00mm|0,90/2,00mm|1,32/3,00mm 0,25 /0,50 mm|1,54 /5,00mm
Operating temperature °C from -60 °C to 180 °C from -60 °C to 180 °C